Synchronous SRAM chip with 18M-bit density, organized as 1M words by 18 bits. Features a 2.5 ns maximum access time and operates at a maximum clock rate of 167 MHz with QDR architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package measuring 15mm x 13mm x 0.89mm with a 1mm pin pitch. It requires a 2.5V supply voltage (2.4V to 2.6V range) and has a maximum operating current of 500 mA, suitable for operation between 0°C and 70°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress CY7C1303CV25-167BZXC technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 15 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.49956 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 18Mbit |
| Address Bus Width | 19bit |
| Maximum Access Time | 2.5ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 167MHz |
| Data Rate Architecture | QDR |
| Density in Bits | 18874368bit |
| Maximum Operating Current | 500mA |
| Typical Operating Supply Voltage | 2.5V |
| Number of Bits per Word | 18bit |
| Number of Ports | 1 |
| Number of Words | 1M |
| Min Operating Supply Voltage | 2.4V |
| Max Operating Supply Voltage | 2.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Architecture | Pipelined |
Compliance
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress CY7C1303CV25-167BZXC Datasheet
Download the complete datasheet for Cypress CY7C1303CV25-167BZXC to view detailed technical specifications.
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