Synchronous SRAM chip, 18M-bit density, organized as 512K words by 36 bits. Features a 2.5 ns maximum access time and operates at a maximum clock rate of 167 MHz with QDR architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package with a 1 mm pin pitch. It operates from a 2.5 V supply voltage, with a range of 2.4 V to 2.6 V, and supports a maximum operating current of 500 mA. The device is designed for a temperature range of 0 °C to 70 °C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress CY7C1306CV25-167BZC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
165
PCB
165
Package Length (mm)
15
Package Width (mm)
13
Package Height (mm)
0.89
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.49956
Package Material
Plastic
Mounting
Surface Mount
Density
18Mbit
Address Bus Width
18bit
Maximum Access Time
2.5ns
Timing Type
Synchronous
Maximum Clock Rate
167MHz
Data Rate Architecture
QDR
Density in Bits
18874368bit
Maximum Operating Current
500mA
Typical Operating Supply Voltage
2.5V
Number of Bits per Word
36bit
Number of Ports
1
Number of Words
512K
Min Operating Supply Voltage
2.4V
Max Operating Supply Voltage
2.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Architecture
Pipelined
Compliance
Cage Code
65786
EU RoHS
No
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress CY7C1306CV25-167BZC Datasheet
Download the complete datasheet for Cypress CY7C1306CV25-167BZC to view detailed technical specifications.
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