Synchronous SRAM chip, 18M-bit density, featuring a 2.5ns access time and 167MHz clock rate. This QDR, pipelined architecture component offers 512K words x 36 bits per word, operating at a 2.5V supply voltage. Encased in a 165-pin FBGA package with a 1mm pitch, it supports surface mount installation. Operating temperature range is -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress CY7C1306CV25-167BZI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 15 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.49956 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 18Mbit |
| Address Bus Width | 18bit |
| Maximum Access Time | 2.5ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 167MHz |
| Data Rate Architecture | QDR |
| Density in Bits | 18874368bit |
| Maximum Operating Current | 500mA |
| Typical Operating Supply Voltage | 2.5V |
| Number of Bits per Word | 36bit |
| Number of Ports | 1 |
| Number of Words | 512K |
| Min Operating Supply Voltage | 2.4V |
| Max Operating Supply Voltage | 2.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Architecture | Pipelined |
Compliance
| Cage Code | 65786 |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Cypress CY7C1306CV25-167BZI Datasheet
Download the complete datasheet for Cypress CY7C1306CV25-167BZI to view detailed technical specifications.
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