Synchronous SRAM chip, 36M-bit density, organized as 4M x 8 bits. Features a 0.45 ns maximum access time and operates at a maximum clock rate of 200 MHz with QDR architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package measuring 17mm x 15mm x 0.89mm. Operates from a 1.8V supply voltage, with a minimum of 1.7V and maximum of 1.9V, and supports a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Cypress CY7C1411JV18-200BZI technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 17 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 36Mbit |
| Address Bus Width | 20bit |
| Maximum Access Time | 0.45ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 200MHz |
| Data Rate Architecture | QDR |
| Density in Bits | 37748736bit |
| Maximum Operating Current | 620mA |
| Typical Operating Supply Voltage | 1.8V |
| Number of Bits per Word | 8bit |
| Number of Ports | 1 |
| Number of Words | 4M |
| Min Operating Supply Voltage | 1.7V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Architecture | Pipelined |
Compliance
| Cage Code | 65786 |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Cypress CY7C1411JV18-200BZI Datasheet
Download the complete datasheet for Cypress CY7C1411JV18-200BZI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.