Synchronous SRAM chip with 36M-bit density, organized as 1M words by 36 bits. Features a 0.45 ns maximum access time and operates at a maximum clock rate of 633 MHz with DDR data rate architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package measuring 15mm x 13mm x 0.89mm. It operates from a typical supply voltage of 1.8V, with a range of 1.7V to 1.9V, and has a maximum operating current of 1230 mA. The architecture is pipelined, suitable for a wide range of demanding applications.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress CY7C2270XV18-633BZXC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
165
PCB
165
Package Length (mm)
15
Package Width (mm)
13
Package Height (mm)
0.89
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.49956
Package Material
Plastic
Mounting
Surface Mount
Density
36Mbit
Address Bus Width
19bit
Maximum Access Time
0.45ns
Timing Type
Synchronous
Maximum Clock Rate
633MHz
Data Rate Architecture
DDR
Density in Bits
37748736bit
Maximum Operating Current
1230mA
Typical Operating Supply Voltage
1.8V
Number of Bits per Word
36bit
Number of Ports
1
Number of Words
1M
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Architecture
Pipelined
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress CY7C2270XV18-633BZXC Datasheet
Download the complete datasheet for Cypress CY7C2270XV18-633BZXC to view detailed technical specifications.
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