PackageDIP
MountingThrough Hole
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Technical Specifications
Cypress CY8C22113-24PI technical specifications.
General
Access Time
24us
Package/Case
DIP
Core Architecture
M8C
Interface
I2C, SPI, UART, USART
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
2KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Through Hole
Number of I/Os
6
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT, LVD
RAM Size
256B
RoHS Compliant
No
Series
PSOC®1 CY8C22xxx
Compliance
RoHS
Not Compliant
Datasheet
Cypress CY8C22113-24PI Datasheet
Download the complete datasheet for Cypress CY8C22113-24PI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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