PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress CYWB0224ABS-BZXI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
121
PCB
121
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Interface Type
SPI
Type
USB Controller
USB Speed Type
Full Speed|High Speed
USB Transceiver
Yes
Protocols Supported
USB 2.0
Maximum Data Rate
480Mbps
Maximum Operating Frequency
26MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542390000
ECCN
3A991.a.3
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress CYWB0224ABS-BZXI Datasheet
Download the complete datasheet for Cypress CYWB0224ABS-BZXI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.