32M-bit NOR Flash memory with parallel interface, featuring 80ns maximum access time. This surface-mount component offers 4M x 8 or 2M x 16 word configurations and operates at a typical 3.3V supply voltage. The 57-pin Fine Pitch Ball Grid Array (FBGA) package measures 13.95mm x 7.95mm with a 0.8mm pin pitch. It supports asymmetrical block organization, sectored architecture, and includes a bottom boot block. Operating temperature range is -20°C to 70°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL322BD-80PBT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 57 |
| PCB | 57 |
| Package Length (mm) | 13.95 |
| Package Width (mm) | 7.95 |
| Package Height (mm) | 0.69 |
| Seated Plane Height (mm) | 1.05 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 80ns |
| Number of Words | 4M/2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 22/21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 65786 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress MBM29DL322BD-80PBT Datasheet
Download the complete datasheet for Cypress MBM29DL322BD-80PBT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.