32M-bit NOR Flash memory with parallel interface, featuring 4M x 8 or 2M x 16 word organization and a maximum access time of 90ns. This component supports 3V/3.3V operation with asymmetrical block architecture and a bottom boot block location. Packaged in a 48-pin TSOP-I (Thin Small Outline Package Type I) for surface mounting, it operates across a temperature range of -40°C to 85°C. Programming voltage ranges from 2.7V to 3.6V, with an additional 8.5V to 9.5V range.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL322BD-90PFTN-E1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
18mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Asynchronous
Maximum Access Time
90ns
Number of Words
4M/2M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22/21bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress MBM29DL322BD-90PFTN-E1 Datasheet
Download the complete datasheet for Cypress MBM29DL322BD-90PFTN-E1 to view detailed technical specifications.
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