32M-bit NOR Flash memory with parallel interface, offering 4M x 8 or 2M x 16 word configurations. Features a 120ns maximum access time and supports 3V/3.3V operation with asymmetrical, sectored block organization and a bottom boot block. Packaged in a 48-pin TSOP-I (Thin Small Outline Package Type I) for surface mounting, with dimensions of 12mm x 18.4mm x 1mm. Operates across a temperature range of -40°C to 85°C.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL322BE-12TN technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1(Min)
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
18mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Asynchronous
Maximum Access Time
120ns
Number of Words
4M/2M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22/21bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress MBM29DL322BE-12TN Datasheet
Download the complete datasheet for Cypress MBM29DL322BE-12TN to view detailed technical specifications.
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