
32M-bit NOR Flash memory with a parallel interface, featuring 4M x 8 or 2M x 16 organization and a 120ns maximum access time. This surface-mount component utilizes a 57-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch. It operates from 3V or 3.3V supply voltages, with programming voltages ranging from 2.7 to 3.6V and 8.5 to 9.5V. The memory architecture is sectored with asymmetrical block organization and includes a top boot block. Operating temperature range is -40°C to 85°C.
Cypress MBM29DL324TE-12PBT-E1 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 57 |
| PCB | 57 |
| Package Length (mm) | 13.95 |
| Package Width (mm) | 7.95 |
| Package Height (mm) | 0.69 |
| Seated Plane Height (mm) | 1.05 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 120ns |
| Number of Words | 4M/2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 22/21bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Cypress MBM29DL324TE-12PBT-E1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.