32M-bit NOR Flash memory with parallel interface, offering 4M x 8 or 2M x 16 word configurations. Features a 120ns maximum access time and supports 3V/3.3V operation with asymmetrical sectored block organization and a top boot block. Packaged in a 48-pin TSOP-I (Thin Small Outline Package Type I) for surface mounting, with dimensions of 12mm x 18.4mm x 1mm. Operates across a temperature range of -40°C to 85°C.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL324TE-12TN technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-I |
| Package Description | Thin Small Outline Package (Type I) |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12 |
| Package Width (mm) | 18.4 |
| Package Height (mm) | 1(Min) |
| Seated Plane Height (mm) | 1.1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 120ns |
| Number of Words | 4M/2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 22/21bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 65786 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress MBM29DL324TE-12TN Datasheet
Download the complete datasheet for Cypress MBM29DL324TE-12TN to view detailed technical specifications.
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