32M-bit NOR Flash memory with a parallel interface, featuring a 2M x 16 word organization and 120ns maximum access time. This surface-mount component operates at 2.5V, with programming voltages ranging from 2.5V to 12.5V. The 48-pin TSOP-I package, with gull-wing leads, is constructed from plastic and measures 12mm x 18.4mm x 1mm. It supports asymmetrical block organization, sectored architecture, and includes a top-located boot block. Operating temperature range is -40°C to 85°C.
PackageTSOP-I
MountingSurface Mount
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Technical Specifications
Cypress MBM29PDD322TE-12TN-E1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1(Min)
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
35mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.5|8.5 to 12.5V
Timing Type
Asynchronous
Maximum Access Time
120ns
Number of Words
2M
Boot Block
Yes
Typical Operating Supply Voltage
2.5V
Address Bus Width
21bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Cypress MBM29PDD322TE-12TN-E1 Datasheet
Download the complete datasheet for Cypress MBM29PDD322TE-12TN-E1 to view detailed technical specifications.
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