16M-bit NOR Flash memory with parallel interface, featuring 2M x 8 or 1M x 16 word organization and a maximum access time of 100 ns. This surface-mount component utilizes a 48-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8 mm pin pitch, measuring 9 x 8 x 0.85 mm. It supports asynchronous timing, has a 21/20-bit address bus, and includes a top boot block. Operating current is 25 mA, with programming voltages ranging from 1.8-2.2 V and 8.5-9.5 V, across an industrial temperature range of -40 °C to 85 °C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress MBM29SL160TD-10PBT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 25mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 1.8 to 2.2|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 100ns |
| Number of Words | 2M/1M |
| Boot Block | Yes |
| Address Bus Width | 21/20bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 65786 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress MBM29SL160TD-10PBT Datasheet
Download the complete datasheet for Cypress MBM29SL160TD-10PBT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.