32M-bit NAND Flash memory with a parallel interface, featuring a 4M x 8 organization. This component offers a 3.3V operating voltage and a maximum access time of 7000 ns. Packaged in a 40-pin TSOP-II (Thin Small Outline Package Type II) with gull-wing leads for surface mounting, it operates within a temperature range of -40°C to 85°C. The memory architecture is sectored and block-organized symmetrically, with an address bus width of 22 bits.
PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Cypress MBM30LV0032-PFTN-E1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
40
PCB
40
Package Length (mm)
18.41
Package Width (mm)
10.16
Package Height (mm)
1.1
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
7000ns
Number of Words
4M
Boot Block
No
Typical Operating Supply Voltage
3.3V
Address Bus Width
22bit
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Cypress MBM30LV0032-PFTN-E1 Datasheet
Download the complete datasheet for Cypress MBM30LV0032-PFTN-E1 to view detailed technical specifications.
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