512M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface. Features 3V/3.3V operation, 14.5ns access time, and 1/2/4 bit per word configuration. This surface-mount SOIC W package offers 16 pins with gull-wing leads, a 1.27mm pitch, and dimensions of 10.3mm x 7.5mm x 2.55mm. Supports 32-bit addressing, symmetrical block organization, and includes boot block functionality at the bottom or top.
PackageSOIC W
MountingSurface Mount
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Technical Specifications
Cypress S25FL512SAGMFIR11 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.3
Package Width (mm)
7.5
Package Height (mm)
2.55(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AA
Density
512Mbit
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Current
100mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Synchronous
Maximum Access Time
14.5ns
Number of Words
512M/256M/128M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
32bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
1/2/4bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320051
Schedule B
8542320050
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress S25FL512SAGMFIR11 Datasheet
Download the complete datasheet for Cypress S25FL512SAGMFIR11 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.