4M-bit NOR Flash memory with a parallel interface, offering 55ns maximum access time. Features include 512K x 8 or 256K x 16 word organization, 19/18-bit address bus, and a bottom boot block. Operates from a 3 to 3.6V programming voltage with a typical 3.3V supply, drawing a maximum of 16mA. Packaged in a 48-pin TSOP (Thin Small Outline Package) for surface mounting, with dimensions of 12mm x 18.4mm x 1mm and a 0.5mm pin pitch. Suitable for operation across a wide temperature range of -40°C to 125°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Cypress S29AL004D55TANR22 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-142DD
Density
4Mbit
Interface Type
Parallel
Maximum Operating Current
16mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
3 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
55ns
Number of Words
512K/256K
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
19/18bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
65786
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress S29AL004D55TANR22 Datasheet
Download the complete datasheet for Cypress S29AL004D55TANR22 to view detailed technical specifications.
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