4M-bit NOR Flash memory with parallel interface, offering 512K x 8 or 256K x 16 word configurations. Features a 55ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. This component is housed in a 48-pin TSOP (Thin Small Outline Package) for surface mounting, with a gull-wing lead shape and a 0.5mm pin pitch. The memory architecture is sectored with a bottom boot block, supporting an address bus width of 19 or 18 bits. Operating temperature range is -40°C to 85°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Cypress S29AL004D55TFI022 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-142DD
Density
4Mbit
Interface Type
Parallel
Maximum Operating Current
16mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
55ns
Number of Words
512K/256K
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
19/18bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress S29AL004D55TFI022 Datasheet
Download the complete datasheet for Cypress S29AL004D55TFI022 to view detailed technical specifications.
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