4M-bit NOR Flash memory with a parallel interface, featuring 90ns access time. This component offers 512K x 8 or 256K x 16 word organization and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. The 48-pin FBGA package, measuring 8.15mm x 6.15mm x 0.76mm, supports surface mount installation. It includes a top boot block and operates across a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress S29AL004D90BFI011 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
48
PCB
48
Package Length (mm)
8.15
Package Width (mm)
6.15
Package Height (mm)
0.76(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
4Mbit
Interface Type
Parallel
Maximum Operating Current
16mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
90ns
Number of Words
512K/256K
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
19/18bit
Location of Boot Block
Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress S29AL004D90BFI011 Datasheet
Download the complete datasheet for Cypress S29AL004D90BFI011 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.