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Technical Specifications
Data Device BU-65864R3-E02 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
20.7(Max)
Package Width (mm)
20.7(Max)
Package Height (mm)
3.58(Max)
Seated Plane Height (mm)
3.58(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCI Frequency
33MHz
Bridge Type
PCI to PCI
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
ECC Support
No
GPIO
No
Compliance
Cage Code
0HYU1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Data Device BU-65864R3-E02 Datasheet
Download the complete datasheet for Data Device BU-65864R3-E02 to view detailed technical specifications.
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