PackageSMC
MountingSurface Mount
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Technical Specifications
EIC Semiconductor SMCJ8.5C technical specifications.
General
Package/Case
SMC
Pin Count
2
PCB
2
Package Length (mm)
7
Package Width (mm)
5.8
Package Height (mm)
2.2
Seated Plane Height (mm)
2.3
Package Material
Plastic
Mounting
Surface Mount
Direction Type
Bi-Directional
Configuration
Single
Maximum Reverse Stand-Off Voltage
8.5V
Maximum Reverse Leakage Current
20uA
Maximum Clamping Voltage
15.9V
Maximum Peak Pulse Current
94.3A
Minimum Breakdown Voltage
9.44V
Peak Pulse Power Dissipation
1500W
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Operating Junction Temperature
-55 to 150°C
Number of Elements per Chip
1
Compliance
Cage Code
37JK6
EU RoHS
Yes
HTS Code
8541100080
Schedule B
8541100080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
EIC Semiconductor SMCJ8.5C Datasheet
Download the complete datasheet for EIC Semiconductor SMCJ8.5C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.