16M-bit NOR Flash memory with a parallel interface, offering 1M words x 16 bits. Features a 70ns maximum access time and operates at a typical 1.8V supply voltage. Packaged in a 48-Pin TFBGA (Thin Fine Pitch Ball Grid Array) with a 0.8mm pin pitch, measuring 8mm x 6mm x 0.91mm. Supports surface mounting and includes a boot block with bottom and top location options. Operates across a -40°C to 85°C temperature range.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Elite Semiconductor EN39SL160AL-70BIP technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.91 |
| Seated Plane Height (mm) | 1.3(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 1M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 20bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Elite Semiconductor EN39SL160AL-70BIP Datasheet
Download the complete datasheet for Elite Semiconductor EN39SL160AL-70BIP to view detailed technical specifications.
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