100-Pin LFCSP EP Tray analog switch IC featuring a 16x16 array configuration. This surface mount component offers a 700 MHz typical 3dB bandwidth, supporting dual supply voltages from ±4.5 V to ±5.5 V. The Lead Frame Chip Scale Package measures 12mm x 12mm x 0.84mm with a 0.4mm pin pitch, operating across a -40 °C to 85 °C temperature range.
PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADV3226ACPZ technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | CSP |
| Package/Case | LFCSP EP |
| Package Description | Lead Frame Chip Scale Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 100 |
| PCB | 100 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 0.84 |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Array Configuration | 16x16 |
| Number of Arrays | 1 |
| Category | General Purpose |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| 3dB Bandwidth Range | >=250MHz |
| 3dB Bandwidth | 700(Typ)MHz |
| Minimum Dual Supply Voltage | ±4.5V |
| Typical Dual Supply Voltage | ±5V |
| Maximum Dual Supply Voltage | ±5.5V |
| Power Supply Type | Dual |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices ADV3226ACPZ Datasheet
Download the complete datasheet for Analog Devices ADV3226ACPZ to view detailed technical specifications.
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