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256K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Density: 9Mb

72T36125L5BBG 256Kx36 BGA Surface Mount Flash Memory

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Density: 9Mb

256K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Density: 9Mb

256K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Copper, Tin, Silver

Density: 9Mb

128K x 36 TeraSync FIFO, 2.5V

Volume Production

Bus Directional: Unidirectional

Package/Case: BGA

Contact Plating: Tin, Lead

Density: 4.5Mb

IDT72T36125L5BBGI

IDT 72T36125L5BBGI 5ns BGA Surface Mount IC

Unknown

Access Time: 5ns

Package/Case: BGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C