Browse Categories Browse Manufacturers Search Parts Updated Parts

©2026 Datasheets.com

Search Results for "89H16NT2G2ZCHLG"

Filters

89H12NT12G2ZCHLG8

PCI Express Switch System Interconnect Switch 12Lanes 12 Port 324-Pin FCBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H16NT16G2ZCHLG8

PCI Express Switch System Interconnect Switch 16Lanes 16 Port 324-Pin FCBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H16NT16G2ZCHLGI

PCI Interface IC PCIE SWITCH

Volume Production

Package/Case: FCBGA

Data Rate: 128Gbps

Interface: PCI Express

Lead Free: Lead Free

89H12NT12G2ZCHLG

PCIE SWITCH

Volume Production

Package/Case: FCBGA

Contact Plating: Copper, Tin, Silver

Data Rate: 96Gbps

Interface: PCI Express

89H12NT12G2ZCHLG

Integrated Device Technology

FCBGA-324, Tray

BGA, BGA324,18X18,40

Transferred

Max Operating Temperature: 70

Number of Terminals: 324

Min Operating Temperature: 0

Terminal Position: BOTTOM

89H16NT16G2ZCHLGI

Integrated Device Technology

FCBGA-324, Tray

19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324

Transferred

Max Operating Temperature: 85

Number of Terminals: 324

Min Operating Temperature: -40

Terminal Position: BOTTOM

89H12NT12G2ZCHLG8

Integrated Device Technology

FCBGA-324, Reel

,

Transferred

Pin Count: 324

uPs/uCs/Peripheral ICs Type: BUS CONTROLLER, PCI