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2Kb MICROWIRE Serial EEPROM, 256x8, SOIC, 250ns Access

3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8

Active

Access Time-Max: 250ns

Package/Case: SOIC

Contact Plating: Tin, Matte

Density: 2Kb

2Kb EEPROM, 256x8, MICROWIRE Serial, MSOP, 250ns Access

ROHS COMPLIANT, PLASTIC, MSOP-8

Active

Access Time-Max: 250ns

Package/Case: MSOP

Contact Plating: Tin, Matte

Density: 2Kb

IC EEPROM 2K SPI 2MHZ 8TSSOP

Volume Production

Access Time-Max: 250ns

Package/Case: TSSOP

Contact Plating: Tin, Matte

Density: 2Kb

2Kb MICROWIRE EEPROM, 256x8 Organization, TSSOP-8 Package

4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

Active

Package/Case: TSSOP

Interface: MICROWIRE

Max Frequency: 1MHz

Max Operating Temperature: 85°C

8-Pin DFN-8 Industrial EEPROM with 256 Words, 1.8-5.5V, 0.002A

2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

8-Pin Industrial EEPROM IC, 256 Words, 1.8-5.5V, SOIC-8

0.150 INCH, ROHS COMPLIANT, PLASTIC, MS-012, SOIC-8

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL