Industrial temperature grade peripheral IC with 400 terminals, featuring a 400-pin Ball Grid Array (BGA) package. The PBGA400 package measures 17 x 17 mm with a 0.80 mm pitch, adhering to JEDEC standard S-PBGA-B400. Terminals are positioned on the bottom of the RoHS compliant plastic package.
Quick Jump:
Technical Specifications
Freescale Semiconductor MCIMX353CJQ5C technical specifications.
General
| Number of Terminals | 400 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | S-PBGA-B400 |
| Width | 17 |
| Length | 17 |
| Pin Count | 400 |
| Temperature Grade | INDUSTRIAL |
Compliance
| RoHS | Yes |
| Eccn Code | 5A002.A |
| Lead Free | Yes |
| HTS Code | 8542.31.00.01 |
| REACH | unknown |
| Military Spec | False |
Datasheet
Freescale Semiconductor MCIMX353CJQ5C Datasheet
Download the complete datasheet for Freescale Semiconductor MCIMX353CJQ5C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.