Industrial temperature grade peripheral IC with 400 terminals, featuring a 400-pin Ball Grid Array (BGA) package. The PBGA400 package measures 17 x 17 mm with a 0.80 mm pitch, adhering to JEDEC standard S-PBGA-B400. Terminals are positioned on the bottom of the RoHS compliant plastic package.
Quick Jump:
Technical Specifications
Freescale Semiconductor MCIMX353CJQ5C technical specifications.
General
Number of Terminals
400
Terminal Position
BOTTOM
JEDEC Package Code
S-PBGA-B400
Width
17
Length
17
Pin Count
400
Temperature Grade
INDUSTRIAL
Compliance
RoHS
Yes
Eccn Code
5A002.A
Lead Free
Yes
HTS Code
8542.31.00.01
REACH
unknown
Military Spec
False
Datasheet
Freescale Semiconductor MCIMX353CJQ5C Datasheet
Download the complete datasheet for Freescale Semiconductor MCIMX353CJQ5C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.