Synchronous SRAM chip with 72M-bit density, organized as 4M words x 18 bits. Features a 0.45ns maximum access time and operates at a maximum clock rate of 300MHz with QDR architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch. It operates from a typical 1.8V supply voltage, with a range of 1.7V to 1.9V, and supports a 20-bit address bus. The operating temperature range is -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
GSI GS8672D18AE-300I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
165
PCB
165
Package Length (mm)
17
Package Width (mm)
15
Package Height (mm)
1.04(Max)
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
72Mbit
Address Bus Width
20bit
Maximum Access Time
0.45ns
Timing Type
Synchronous
Maximum Clock Rate
300MHz
Data Rate Architecture
QDR
Density in Bits
75497472bit
Typical Operating Supply Voltage
1.8V
Number of Bits per Word
18bit
Number of Ports
2
Number of Words
4M
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Architecture
Pipelined
Compliance
Cage Code
3BKC7
EU RoHS
No
HTS Code
8542320041
Schedule B
8542320040
ECCN
3A991.b.2.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
GSI GS8672D18AE-300I Datasheet
Download the complete datasheet for GSI GS8672D18AE-300I to view detailed technical specifications.
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