Synchronous SRAM chip, 72M-bit density, organized as 4M words x 18 bits. Features a 0.45 ns maximum access time and operates at a maximum clock rate of 250 MHz with DDR data rate architecture. This surface-mount component utilizes a 165-pin Fine Pitch Ball Grid Array (FBGA) package with a 1 mm pin pitch. It operates from a 1.8 V supply voltage, with a range of 1.7 V to 1.9 V, and supports a temperature range of -40 °C to 85 °C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
GSI GS8672T18AE-250I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 17 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.04(Max) |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 72Mbit |
| Address Bus Width | 22bit |
| Maximum Access Time | 0.45ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 250MHz |
| Data Rate Architecture | DDR |
| Density in Bits | 75497472bit |
| Typical Operating Supply Voltage | 1.8V |
| Number of Bits per Word | 18bit |
| Number of Ports | 1 |
| Number of Words | 4M |
| Min Operating Supply Voltage | 1.7V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Architecture | Pipelined |
Compliance
| Cage Code | 3BKC7 |
| EU RoHS | No |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
GSI GS8672T18AE-250I Datasheet
Download the complete datasheet for GSI GS8672T18AE-250I to view detailed technical specifications.
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