The GS881Z36CD-300I is a 9Mb SRAM IC with an 18-bit address bus width. It is packaged in a Flip Chip Ball Grid Array (FBGA) and is available in a tray packaging format. The device operates over a temperature range of -40°C to 85°C. It is not designed for radiation hardening and is not RoHS compliant.
PackageFBGA
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Technical Specifications
GSI GS881Z36CD-300I technical specifications.
General
| Address Bus Width | 18b |
| Package/Case | FBGA |
| Density | 9Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 1 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
GSI GS881Z36CD-300I Datasheet
Download the complete datasheet for GSI GS881Z36CD-300I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.