The GS88236BGD-200I is an 18-bit SRAM IC with a density of 9Mb. It is packaged in a FBGA package and is available in a tray. The IC operates within a temperature range of -40°C to 85°C. It is RoHS compliant and not radiation hardened. The GS88236BGD-200I is a product of GSI.
PackageFBGA
Quick Jump:
Technical Specifications
GSI GS88236BGD-200I technical specifications.
General
| Address Bus Width | 18b |
| Package/Case | FBGA |
| Density | 9Mb |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Ports | 4 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
GSI GS88236BGD-200I Datasheet
Download the complete datasheet for GSI GS88236BGD-200I to view detailed technical specifications.
No datasheet is available for this part.