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Technical Specifications
Hamamatsu Photonics S8168 technical specifications.
General
Basic Package Type
Through Hole
Lead Shape
Through Hole
Pin Count
2
PCB
2
Package Height (mm)
2.3
Seated Plane Height (mm)
2.88(Max)
Pin Pitch (mm)
2.54
Package Diameter (mm)
5.4
Mounting
Through Hole
Type
Chip
Photo Sensitivity
0.42A/W
Min Operating Temperature
-20°C
Max Operating Temperature
60°C
Peak Wavelength
620nm
Photodiode Material
Si
Maximum Dark Current
10nA
Compliance
EU RoHS
Yes
HTS Code
8541406010
Schedule B
8541406010
ECCN
EAR99
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Hamamatsu Photonics S8168 Datasheet
Download the complete datasheet for Hamamatsu Photonics S8168 to view detailed technical specifications.
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