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Technical Specifications
Hamamatsu Photonics S8168 technical specifications.
General
| Basic Package Type | Through Hole |
| Lead Shape | Through Hole |
| Pin Count | 2 |
| PCB | 2 |
| Package Height (mm) | 2.3 |
| Seated Plane Height (mm) | 2.88(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Diameter (mm) | 5.4 |
| Mounting | Through Hole |
| Type | Chip |
| Photo Sensitivity | 0.42A/W |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 60°C |
| Peak Wavelength | 620nm |
| Photodiode Material | Si |
| Maximum Dark Current | 10nA |
Compliance
| EU RoHS | Yes |
| HTS Code | 8541406010 |
| Schedule B | 8541406010 |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Hamamatsu Photonics S8168 Datasheet
Download the complete datasheet for Hamamatsu Photonics S8168 to view detailed technical specifications.
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