Hologram, Inc.
SIM-E-MFF2-GL-250
Hologram Global IoT Embedded eUICC SIM, MFF2 (DFN8) Form Factor, 250-Pack
The SIM-E-MFF2-GL-250 is an industrial-grade embedded SIM (eSIM) from Hologram, provided in a 250-unit pack. It utilizes the MFF2 (DFN8) surface-mount form factor, which is designed for machine-to-machine (M2M) applications requiring higher durability than standard plastic SIM cards. This eUICC-compliant SIM allows for remote over-the-air (OTA) updates to connectivity profiles and supports global network access across 2G, 3G, 4G LTE, and LPWAN technologies including LTE-M and NB-IoT. It is built on a Samsung S3FW9FG chip platform and provides fallback functionality to ensure persistent connectivity.
Temp Range-25 to +85°C
Voltage1.6, 3, 5V
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Technical Specifications
Hologram, Inc. SIM-E-MFF2-GL-250 technical specifications.
General
| Operating Temperature Range | -25 to +85°C |
| Operating Voltage | 1.6, 3, 5V |
| Memory (NVM) | 340KB |
| Memory (SRAM) | 10KB |
| Write Endurance | 500000cycles |
| Data Retention | 25years |
| Dimensions | 6.0 x 5.0 x 0.82mm |
| Network Technology | 2G, 3G, 4G LTE, LTE-M, NB-IoT |
Compliance
| RoHS | Compliant (2011/65/EU) |
| Standard | ETSI 3GPP TS 102 221 Class A, B, C |
| Standard | ISO/IEC 7816-3 |
| Security | Common Criteria EAL5+ |
Datasheet
Hologram, Inc. SIM-E-MFF2-GL-250 Datasheet
Download the complete datasheet for Hologram, Inc. SIM-E-MFF2-GL-250 to view detailed technical specifications.
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