8-channel Ethernet PHY supporting 10/100 Mbps data rates. Features include JTAG support and RMII/SMII/SS-SMII interfaces. This surface mountable, plastic Ball Grid Array component has 241 pins with a 1.27mm pitch, measuring 23x23x1.78mm. Operates with analog and digital power supplies ranging from 2.38V to 3.46V, with a maximum supply current of 835mA. Suitable for 0°C to 70°C operating temperatures.
PackageBGA
MountingSurface Mount
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Technical Specifications
Inphi FWLXT9785BC.B2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
241
PCB
241
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
1.78
Seated Plane Height (mm)
2.38
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Number of Channels per Chip
8
Maximum Data Rate
100Mbps
PHY Line Side Interface
No
JTAG Support
Yes
Standard Supported
10BASE-T|100BASE-X|100BASE-TX|100BASE-FX|IEEE 802.3|IEEE 802.3u
Typical Data Rate
10/100Mbps
Integrated CDR
No
Power Supply Type
Analog|Digital
Min Operating Supply Voltage
2.38V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Ethernet Interface Type
RMII/SMII/SS-SMII
Ethernet Speed
10Mbps/100Mbps
Overhead Octet Support
No
Max Operating Supply Voltage
2.63|3.46V
Maximum Supply Current
835mA
Typical Operating Supply Voltage
2.5|3.3V
Compliance
Cage Code
3C616
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Inphi FWLXT9785BC.B2 Datasheet
Download the complete datasheet for Inphi FWLXT9785BC.B2 to view detailed technical specifications.
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