PackageBGA
MountingSurface Mount
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Technical Specifications
Intel JL82599EBSLGWG technical specifications.
General
| Package/Case | BGA |
| Max Power Dissipation | 100mW |
| Mount | Surface Mount |
| Package Quantity | 480 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Intel JL82599EBSLGWG Datasheet
Download the complete datasheet for Intel JL82599EBSLGWG to view detailed technical specifications.
No datasheet is available for this part.