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Technical Specifications
Intel PLB2224EV1.3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
272
PCB
272
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.17
Seated Plane Height (mm)
2.35(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
PHY/Transceiver Interface
MII/GMII/SMII
Number of Primary Switch Ports
26
Maximum Data Rate
1000Mbps
Fiber Support
No
Integrated LED Drivers
Yes
JTAG Support
No
Typical Data Rate
10/100/1000Mbps
Compliance
Cage Code
4BA62
HTS Code
8517620020
Schedule B
8517620050
ECCN
5A991.c.10.b
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel PLB2224EV1.3 Datasheet
Download the complete datasheet for Intel PLB2224EV1.3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.