N-channel enhancement mode power MOSFET featuring 250V drain-source voltage and 76A continuous drain current. This single element transistor utilizes TrenchFET process technology and offers a low drain-source on-resistance of 39mΩ at 10V. Packaged in a TO-262 (I2PAK) plastic through-hole configuration with 3 pins and a tab, it supports a maximum power dissipation of 460,000mW and operates between -55°C and 150°C.
Ixys IXTI76N25T technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | I2PAK |
| Package/Case | TO-262 |
| Package Description | Transistor Outline Package |
| Lead Shape | Through Hole |
| Pin Count | 3 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 10.29(Max) |
| Package Width (mm) | 4.83(Max) |
| Package Height (mm) | 9.65(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | TO-262AA |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Process Technology | TrenchFET |
| Maximum Drain Source Voltage | 250V |
| Maximum Gate Source Voltage | ±30V |
| Maximum Continuous Drain Current | 76A |
| Maximum Drain Source Resistance | 39@10VmOhm |
| Typical Gate Charge @ Vgs | 92@10VnC |
| Typical Gate Charge @ 10V | 92nC |
| Typical Input Capacitance @ Vds | 4500@25VpF |
| Maximum Power Dissipation | 460000mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
| Cage Code | 6D7E2 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Ixys IXTI76N25T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.