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Technical Specifications
Ixys Z8609316PSC technical specifications.
General
| Package/Case | DIP |
| Core Architecture | Z8 |
| Lead Free | Contains Lead |
| Max Operating Temperature | 70°C |
| Memory Type | ROMless, |
| Min Operating Temperature | 0°C |
| Mount | Through Hole |
| Number of I/Os | 32 |
| Oscillator Type | External |
| Packaging | Rail/Tube |
| Peripherals | POR, WDT |
| RAM Size | 236B |
| RoHS Compliant | No |
| Series | Z8® |
Compliance
| RoHS | Not Compliant |
Datasheet
Ixys Z8609316PSC Datasheet
Download the complete datasheet for Ixys Z8609316PSC to view detailed technical specifications.
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