The Tflex HD90000 series is a high-performance thermal gap filler featuring a silicone-based material with 7.5 W/mK thermal conductivity. It is designed to minimize board and component stress while maintaining excellent thermal performance. This specific part is a grey square pad measuring 9x9 inches with a thickness of 0.050 inches (1.27mm) and features a tacky surface on both sides for easy assembly.
Checking distributor stock and pricing after the page loads.
| Thermal Conductivity | 7.5W/mK |
| Thickness | 1.27mm |
| Dimensions | 228.6 x 228.6mm |
| Hardness | 22Shore 00 |
| Color | Grey |
| Operating Temperature Max | 125Celsius |
| Density | 3.5g/cc |
| Volume Resistivity | 10^14ohm-cm |
| RoHS | Compliant |
