The Tflex HD90000 series is a high-performance thermal gap filler featuring a silicone-based material with 7.5 W/mK thermal conductivity. It is designed to minimize board and component stress while maintaining excellent thermal performance. This specific part is a grey square pad measuring 9x9 inches with a thickness of 0.050 inches (1.27mm) and features a tacky surface on both sides for easy assembly.
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Technical Specifications
Laird A17752-05 technical specifications.
General
| Thermal Conductivity | 7.5W/mK |
| Thickness | 1.27mm |
| Dimensions | 228.6 x 228.6mm |
| Hardness | 22Shore 00 |
| Color | Grey |
| Operating Temperature Max | 125Celsius |
| Density | 3.5g/cc |
| Volume Resistivity | 10^14ohm-cm |
Compliance
| RoHS | Compliant |
Datasheet
Laird A17752-05 Datasheet
Download the complete datasheet for Laird A17752-05 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.