System-on-Chip (SoC) featuring an X86 device core and XChip family architecture. This 184-pin BGA package, measuring 12x12mm, is constructed from plastic with ball leads for surface mounting. It operates at a maximum clock rate of 25 MHz, utilizes CMOS process technology, and includes 256KB of RAM. The SoC supports a typical operating supply voltage of 1.8V or 3.3V and offers a UART interface. Designed for applications in energy and metering, vending machines, and RFID readers, it operates within a temperature range of -40°C to 85°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
Lantronix XCD100100K-01 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
184
PCB
184
Package Length (mm)
12
Package Width (mm)
12
Package Material
Plastic
Mounting
Surface Mount
Family Name
XChip
Device Core
X86
Maximum Clock Rate
25MHz
Program Memory Type
ROMLess
Maximum Speed
25MHz
Process Technology
CMOS
RAM Size
256KB
Type
System-On-Chip
Processing Unit
Microcontroller
Typical Operating Supply Voltage
1.8|3.3V
Number of Programmable I/Os
2
Application
Energy and Metering/Vending machines/RFID readers
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
UART
Programmability
No
Compliance
Cage Code
028A6
EU RoHS
Yes
HTS Code
8517690000
Schedule B
8517690000
ECCN
5A991
RoHS Versions
2011/65/EU
Datasheet
Lantronix XCD100100K-01 Datasheet
Download the complete datasheet for Lantronix XCD100100K-01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.