System-On-Chip (SoC) featuring an X86 device core and CMOS process technology. This 184-pin BGA package, measuring 12x12mm, offers 256KB RAM and a maximum clock rate of 25 MHz. Designed for surface mounting, it operates with a typical supply voltage of 1.8V or 3.3V and supports a UART interface. Ideal for energy and metering, vending machines, and RFID readers, it functions within a temperature range of -40°C to 85°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
Lantronix XCP1001000-01 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
184
PCB
184
Package Length (mm)
12
Package Width (mm)
12
Package Material
Plastic
Mounting
Surface Mount
Family Name
XChip
Device Core
X86
Maximum Clock Rate
25MHz
Program Memory Type
ROMLess
Maximum Speed
25MHz
Process Technology
CMOS
RAM Size
256KB
Type
System-On-Chip
Processing Unit
Microcontroller
Typical Operating Supply Voltage
1.8|3.3V
Number of Programmable I/Os
3
Application
Energy and Metering/Vending machines/RFID readers
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
UART
SPI
0
I2C
0
I2S
0
UART
1
USB
0
USART
0
CAN
0
Ethernet
0
Programmability
No
Compliance
Cage Code
028A6
EU RoHS
Yes
HTS Code
8517690000
Schedule B
8517690000
ECCN
5A991
RoHS Versions
2011/65/EU
Datasheet
Lantronix XCP1001000-01 Datasheet
Download the complete datasheet for Lantronix XCP1001000-01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.