PackagePDIP
MountingThrough Hole
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Technical Specifications
Lapis Semiconductor MSM66P56-02RS technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
18
PCB
18
Package Length (mm)
22.6
Package Width (mm)
6.4
Package Height (mm)
4.57(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Number of Channels per Chip
2
Min Operating Supply Voltage
3.5V
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
5V
Compliance
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Lapis Semiconductor MSM66P56-02RS Datasheet
Download the complete datasheet for Lapis Semiconductor MSM66P56-02RS to view detailed technical specifications.
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