Field Programmable Gate Array (FPGA) with 100,000 system gates and 1792 logic cells, built on 65nm process technology. Features 64 Kbit RAM, 16 block RAMs, and up to 95 user I/Os. This surface-mount device is housed in a 132-pin Chip Scale Ball Grid Array (CSBGA) package, measuring 8mm x 8mm with a 0.5mm pin pitch. Operates within a temperature range of 0°C to 70°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L02F-LCB132C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
132
PCB
132
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
iCE65
Maximum Number of User I/Os
95
RAM Bits
64Kbit
Device Logic Cells
1792
Process Technology
65nm
Device System Gates
100000
Programmability
Yes
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Total Number of Block RAM
16
Compliance
Cage Code
66675
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lattice Semiconductor iCE65L02F-LCB132C Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L02F-LCB132C to view detailed technical specifications.
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