Field Programmable Gate Array (FPGA) with 100,000 system gates and 1792 logic cells, built on 65nm process technology. Features 64 Kbit RAM and 16 Block RAMs, supporting up to 95 user I/Os. Encased in a 132-pin Chip Scale Ball Grid Array (CSBGA) package measuring 8x8x0.85mm with a 0.5mm pin pitch, designed for surface mounting. Operates within a temperature range of -40°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L02F-LCB132I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 95 |
| RAM Bits | 64Kbit |
| Device Logic Cells | 1792 |
| Process Technology | 65nm |
| Device System Gates | 100000 |
| Programmability | Yes |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Total Number of Block RAM | 16 |
Compliance
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Lattice Semiconductor iCE65L02F-LCB132I Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L02F-LCB132I to view detailed technical specifications.
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