Field Programmable Gate Array (FPGA) with 100,000 system gates and 1792 logic cells, built on 65nm process technology. Features 64 Kbit RAM and 16 Block RAMs, supporting up to 95 user I/Os. Encased in a 132-pin Chip Scale Ball Grid Array (CSBGA) package measuring 8x8x0.85mm with a 0.5mm pin pitch, designed for surface mounting. Operates within a temperature range of -40°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L02F-LCB132I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
132
PCB
132
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
iCE65
Maximum Number of User I/Os
95
RAM Bits
64Kbit
Device Logic Cells
1792
Process Technology
65nm
Device System Gates
100000
Programmability
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Total Number of Block RAM
16
Compliance
Cage Code
66675
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lattice Semiconductor iCE65L02F-LCB132I Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L02F-LCB132I to view detailed technical specifications.
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