Field Programmable Gate Array (FPGA) with 100,000 system gates and 1792 logic cells. Features 65nm process technology, 64 Kbit RAM, and 16 block RAMs. Offers 95 maximum user I/Os and operates from 0°C to 70°C. Packaged in a 132-pin Chip Scale Ball Grid Array (CSBGA) with a 0.5mm pin pitch, measuring 8mm x 8mm x 0.85mm. Surface mountable.
Lattice Semiconductor iCE65L02F-UCB132C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | iCE65 |
| Maximum Number of User I/Os | 95 |
| RAM Bits | 64Kbit |
| Device Logic Cells | 1792 |
| Process Technology | 65nm |
| Device System Gates | 100000 |
| Programmability | Yes |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Total Number of Block RAM | 16 |
| Cage Code | 66675 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Lattice Semiconductor iCE65L02F-UCB132C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.