Lattice Semiconductor
iCE65L16F-LCB132C
FPGA iCE65 Family 800K Gates 16896 Cells 65nm Technology 1.2V 132-Pin CSBGA
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor iCE65L16F-LCB132C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
132
PCB
132
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
iCE65
RAM Bits
384Kbit
Device Logic Cells
16896
Process Technology
65nm
Device System Gates
800000
Programmability
Yes
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Total Number of Block RAM
96
Compliance
Cage Code
66675
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Lattice Semiconductor iCE65L16F-LCB132C Datasheet
Download the complete datasheet for Lattice Semiconductor iCE65L16F-LCB132C to view detailed technical specifications.
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