Lattice Semiconductor
LFX125EB-03FN256C
FPGA ispXPGA Family 139K Gates 1936 Cells 2.5V/3.3V Automotive 256-Pin FBGA
PackageFBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor LFX125EB-03FN256C technical specifications.
General
Package/Case
FBGA
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
122Kb
Min Operating Temperature
0°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.3V
Mount
Surface Mount
Number of Gates
139000
Number of I/Os
160
Number of Logic Blocks (LABs)
1936
Number of Logic Elements/Cells
1936
Operating Supply Voltage
2.5V
Package Quantity
90
Packaging
Tray
Radiation Hardening
No
RAM Size
94208b
RoHS Compliant
Yes
Series
ispXPGA®
Compliance
RoHS
Compliant
Datasheet
Lattice Semiconductor LFX125EB-03FN256C Datasheet
Download the complete datasheet for Lattice Semiconductor LFX125EB-03FN256C to view detailed technical specifications.
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