Lattice Semiconductor
LFX200EB-03F256I
Field Programmable Gate Array, 676 CLBs, 210000 Gates, 320MHz, 2704-Cell, CMOS, PBGA256, FPBGA-256
PackageBGA
MountingSurface Mount
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Technical Specifications
Lattice Semiconductor LFX200EB-03F256I technical specifications.
General
Package/Case
BGA
Lead Free
Lead Free
Max Operating Temperature
105°C
Memory Size
154Kb
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of Gates
210000
Number of I/Os
160
Number of Logic Blocks (LABs)
2704
Number of Logic Elements/Cells
2704
Operating Supply Voltage
2.5V
Package Quantity
90
Packaging
Tray
RAM Size
113664b
RoHS Compliant
No
Series
ispXPGA®
Compliance
RoHS
Not Compliant
Datasheet
Lattice Semiconductor LFX200EB-03F256I Datasheet
Download the complete datasheet for Lattice Semiconductor LFX200EB-03F256I to view detailed technical specifications.
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