1M-bit asynchronous SRAM chip, organized as 128K x 8 bits, featuring a 70ns maximum access time. This surface-mount component operates from a 3V supply voltage (2.7V to 5.5V range) and is housed in a 36-pin TFBGA package with a 0.75mm pin pitch. The memory density is 1048576 bits, with an address bus width of 17 bits. Maximum operating current is 50mA, and the operating temperature range is 0°C to 70°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Lyontek LY62W1024GL-70SL technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.94(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 1Mbit |
| Address Bus Width | 17bit |
| Maximum Access Time | 70ns |
| Timing Type | Asynchronous |
| Density in Bits | 1048576bit |
| Maximum Operating Current | 50mA |
| Typical Operating Supply Voltage | 3V |
| Number of Bits per Word | 8bit |
| Number of Ports | 1 |
| Number of Words | 128K |
| Min Operating Supply Voltage | 2.7V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Lyontek LY62W1024GL-70SL Datasheet
Download the complete datasheet for Lyontek LY62W1024GL-70SL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.