Quad-element push-pull RF amplifier operating up to 1000 MHz, delivering 23 dB maximum power gain with 0.6 dB typical gain flatness. Features a 16-pin Thin Shrink Small Outline Package (TSSOP EP) with exposed pad, measuring 5mm x 4.4mm x 1mm, utilizing gull-wing lead-frame SMT mounting. Designed for surface mount applications with a 0.65mm pin pitch, this plastic package operates within a temperature range of -40°C to 85°C. Exhibits typical performance of -70dBc for CTB, Xmod, and CSO at specified test conditions.
PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Macom MAAM-010144-000000 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5
Package Width (mm)
4.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AB
Number of Elements per Chip
4
Maximum Operating Frequency
1000MHz
Maximum CTB @ Test Conditions
-70dBc(Typ)
Maximum Xmod @ Test Conditions
-70dBc(Typ)
Maximum CSO @ Test Conditions
-70dBc(Typ)
Maximum Power Gain @ Maximum Frequency
23dB
Maximum Gain Flatness @ Maximum Frequency
0.6(Typ)dB
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
55NN2
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Macom MAAM-010144-000000 Datasheet
Download the complete datasheet for Macom MAAM-010144-000000 to view detailed technical specifications.
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